Last year, Huawei’s Hisilicon managed to bring down everyone else to release the world’s first 7nm SoC, the Kirin 980. It appears to be as the manufacturer will continue the trend of releasing its new-gen CPU before others, with its Kirin 985 slated to go into mass production in Q2 2019.
The report from Commerical Times (via Digitimes) states that TSMC is readying its 7nm EUV (Extreme Ultraviolet Lithography) process technology, dubbed as the N7+, for the mass production of Hisilicon’s new generation Kirin 985. No matter the issues associated with developing EUV, it will make the manufacturing process at 7nm, inexpensive and faster.
Soon after kicking off number production of Kirin 985, TSMC will start manufacturing Apple’s A13 chipsets by the end of Q2 2019. The Cupertino giant’s chipset will be based on a somewhat alternative technology, dubbed as the N7 Pro. All we have idea about the ‘Pro’ process is that it’s an enhanced version of the N7+.
This announcement is in line with a previous report what mentioned 7nm EUV process for Kirin 985. Because the new technology will speed up the manufacturing process of the chipset, Huawei need to be in a position to ship more telephones with this flagship processor inside. It’s key for the company to make certain a steady provide of its top-end phones since it aims to ship higher than 250 million units by the end of 2019.