Redmi, the year-old subbrand of Xiaomi will be announcing its next flagship cameraphone Redmi K30 Pro on March 24 in China. Ever since the brand introduced the launch date, it has been teasing the specifications of the handset for a handful of days now.
Continuing the trend, the brand’s In general Manager Lu Weibing today unfolded that the next Redmi K30 Pro will cram in up to 61 areas per square centimeter in its chassis.
A couple of days back, Mr. Lu explained the difficulties involved in implementing pop-up camera design in 5G smartphones. He said that 5G sections need much more space and hence manufacturers have been avoiding pop-up cameras lately in 5G devices with Redmi K30 Pro being an exception. He also added that 5G phones require a greater battery and improved thermal performance, which Sadly cannot be achieved by dividing the motherboard into 2 sections – a typical design in smartphones with pop-up cameras.
Thus, Redmi K30 Pro opted for a mixed approach that compelled the brand to adopt the now-common sandwich (stacked) motherboard design unveield in flagship phones like its parent company’s Mi 10 Pro. Like per Mr. Lu, the gadget will cram in up to 61 parts per square centimeter by stacking up one motherboard above an additional. He Additionally said that the cameraphone will include 3885 components, which is 268% more than that of last year’s Redmi K20 Pro.
He Furthermore confirmed that the pop-up camera will pop in / out within 0.58 seconds, due to the new stepper motor with a speed of 14.2mm per second, up from 11.5mm per second of its predecessor. That means, it will be 27% faster than the last generation and hence will retract quicker than before during accidental falls.